
Hickman Becker Bingham Ledesma has filed and negotiated numerous patents for gate-level chip architectures, SoC architectures, fabrication techniques, fab robots, deposition methods, and allied technologies for the Valley’s leading fabbed and fabless foundries and design houses. Our services with regard to patents for semiconductor devices include identifying inventions, developing disclosures, conducting disclosure meetings at any level of formality, studying disclosure materials at any level of formality, drafting, revising, filing, and negotiating with the USPTO or other agencies.
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